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Simultaneous Measurement of Temperature and Strain in Electronic Packages Using Multiframe Super-Resolution Infrared Thermography and Digital Image Correlation
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: For micro-electronic components and systems, reliability under thermomechanical stress is of critical importance. Experimental characterization of hotspots and temperature gradients, which can lead to deformation in the ...
Error Reduction in Infrared Thermography by Multiframe Super-Resolution
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Accurate temperature measurement techniques are critical for monitoring hotspots that induce thermal stresses in electronics packages. Infrared thermography is a popular nonintrusive method for emissivity mapping and ...